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The necessity of thermal conductive materials Whether it is active heat dissipation or passive heat dissipation, it is very important to select a suitable heat conductive material to form a good heat conduction channel, which can effectively transfer the heat on the chip to the heat sink. People often overlook this problem. The role of the thermal medium material is to increase the heat transfer area and form a good heat dissipation channel. For example, the power device is like a reservoir for heat accumulation. The water outlet in the pool is a small water pipe. At the lower end, you can connect a thicker pipe, or simply use a water pump. The flow rate of the water must be limited. Use a suitable heat-conducting material, such as a thicker water conduit at the water outlet, plus a heat sink and a cooling fan to achieve good heat dissipation. I thought the first step in heat dissipation was heat conduction! Therefore, the heat conductive material is not optional, and the good heat conduction has a multiplier effect. While ignoring the application of thermal conductive materials, the heat can not be effectively exported, and the effect of the heat sink or the cooling fan is emphasized. Because of good thermal conduction, it may not need an excessive heat sink, and does not require such a high-power cooling fan, which saves space and cost.
Die cutting processing considerations (1) The location of the die-cutting indentation is not accurate. The cause of the failure is that the position does not match the printed product; the die-cutting and printing positions are not aligned; the cardboard opening rules are different; the paper feeding position is inconsistent during the die-cutting operation; the paperboard is deformed or stretched during operation, and the overprint is not allowed...